포항공대 EESL Fearless challenge

Copper-Graphene Heterostructure for BEOL-Compatible High-Performance Interconnects

Journal

NPJ 2D Materials and Applications

Vol

5(1)

Page

41

Author

M.W.Son, J.W. Jang, Y.S.Lee, W.K.Lee, J.Y.Hwang, I.S. Kim, B.H.Lee, M.H. Ham, S.S.Jee

Year

2021

Date

2021

File

2012 NPJ MWSon.pdf (3.3M) 6회 다운로드 DATE : 2021-07-06 09:02:46