포항공대 EESL Fearless challenge

Interface state degradation during AC positive bias temperature instability stress

Journal

Solid-State Electronics

Vol

158

Page

46-50

Author

S.C. Kang, S.M. Kim, U.J. Jung, Y.H. Kim, W.J. Park, B.H. Lee

Year

2019

Date

2019.05.10

doi

https://doi.org/10.1016/j.sse.2019.05.006

File

2019-SSE-SCKang.pdf (743.7K) 2회 다운로드 DATE : 2021-04-01 21:26:54

Link

https://doi.org/10.1016/j.sse.2019.05.006 197회 연결