A Study of Strain Engineering Using CESL Stressor on Reliability Comparing Effect of Intrinsic Mechanical Stress
Journal
IEEE Electron Device Letters
Vol
30 (7)
Page
760-762
Author
K.T. Lee, C.Y. Kang, M.S. Park, B.H. Lee, H.K. Park, H. Hwang, H.H. Tseng, R. Jammy, Y.H. Jeong
Year
2009
Date
2009.05.27
doi
http://doi.org/10.1109/LED.2009.2021007
File
2009_EDL_KTLEE.pdf (423.1K) 0회 다운로드 DATE : 2021-04-02 17:22:28