A Study of Strain Engineering Using CESL Stressor on Reliability Comparing Effect of Intrinsic Mechanical Stress
- Journal
- IEEE Electron Device Letters
- Vol
- 30 (7)
- Page
- 760-762
- Year
- 2009
- File
- 2009_EDL_KTLEE.pdf (423.1K) 0회 다운로드 DATE : 2021-04-02 17:22:28
- Link
- http://doi.org/10.1109/LED.2009.2021007 157회 연결