포항공대 EESL Fearless challenge

Low temperature integrated complementary graphene barristor to overcome the thermal budget in monolithic 3D integration

Conference

48th IEEE Semiconductor Interface Specilaists Conference (SISC)

Author

S. Heo, Y. J. Kim, K. J. Han, K. Y. Kim, H. I. Lee, S. M. Kim, S. K. Lee, K. E. Chang, J. H. Kim, M. H. Yoon, and B.H.Lee

Year

2017

Date

2017

학회구분

International

File

2017_SISC_SWHeo.PDF (2.0M) 0회 다운로드 DATE : 2021-04-02 14:56:01