포항공대 EESL Fearless challenge

Design Considerations for Patterned Wafer Bonding

Journal

Japanese Journal of Applied Physics

Vol

36

Page

1912

Author

G. Cha, B. H. Lee, K. W. Lee, G. J. Bae, W. D. Kim, J. H. Lee, I. K. Kim, K. C. Park, S. I. Lee and Y. B. Koh

Year

1997

Date

1997.05

File

1997_JJAP_G.Cha.pdf (2.2M) 0회 다운로드 DATE : 2021-04-01 14:56:49