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Mobility Improvement After HCl Post-Deposition Cleaning of High-k dielectric, A Potential Issue in Wet Etching of Dual Metal Gate Process Technology

Journal

IEEE ELECTRON DEVICE LETTERS

Vol

26 (3)

Page

163

Author

M.S. Akbar, N. Moumen, J. Barnett, B. H. Lee e and J.C. Lee

Year

2005

Date

2005.02.28

doi

https://doi.org/10.1109/LED.2005.843210

File

2005_EDL_M.S.Akbar.pdf (108.6K) 0회 다운로드 DATE : 2021-04-01 15:56:28

Link

https://doi.org/10.1109/LED.2005.843210 206회 연결