Copper-Graphene Heterostructure for BEOL-Compatible High-Performance Interconnects
Journal
NPJ 2D Materials and Applications
Vol
5(1)
Page
41
Author
M.W.Son, J.W. Jang, Y.S.Lee, W.K.Lee, J.Y.Hwang, I.S. Kim, B.H.Lee, M.H. Ham, S.S.Jee
Year
2021
Date
2021
File
2012 NPJ MWSon.pdf (3.3M) 5회 다운로드 DATE : 2021-07-06 09:02:46