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열린 분류
1995
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1995
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International
"A Novel CMP Method for Cost-effective Bonded SOI Wafer fabrication"
B.H. Lee, C.J. Kang, J.H. Lee, S.I. Yu, K.W. Lee, K.C. Park and T.E. Shim,
Proceedings of 21st IEEE International SOI Conference,
1995.
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